Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.
Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.
I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity 3um~5um
Auto Exposurer TT08
■ Equipment Specifications:
-
Exposure light source , mask line width reproduction capability , I-line positive photoresist 1um thickness, hard contact, 1um~2um,
proximity 3um~5um.
■ Align the imaging system:
-
Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.
■ production can:
-
For the alignment process , the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour (without considering the material variability).
-
No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour (without considering material variability and unloading).
■ External Dimensions Weight:
-
W: 1900 x D1600 x H2400mm
■ heavy quantity:
