Manual double-sided exposure machine

Manual double-sided exposure machine

Regular price
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Fully automatic single-sided exposure machine
Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.

Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.

The best vacuum contact exposure pattern resolution is within 1um (positive photoresist thickness is 1um)

TT06D

■ Equipment Specifications:

  • Exposure light source , mask line width reproduction capability , I-line positive photoresist 1um thickness, hard contact, 1um~2um,
    proximity 3um~5um.

■ Align the imaging system:

  • Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.

■ production   can:

  • For the alignment process , the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour (without considering the material variability).

  • No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour (without considering material variability and unloading).

■ External Dimensions Weight:

  • W: 1900 x D1600 x H2400mm

■ heavy   quantity:

  • Weight about 1900kg