Fully automatic double-sided exposure machine
Fully automatic double-sided exposure machine
Fully automatic double-sided exposure machine
Fully automatic double-sided exposure machine
Fully automatic double-sided exposure machine
Fully automatic double-sided exposure machine

Fully automatic double-sided exposure machine

Regular price
/

I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity 3um~5um

Fully automatic double-sided exposure machine

Auto Exposurer TT08

Fully automatic double-sided exposure machine

Auto Exposurer 3", 4", 5", 6" 300-CC
Mask alignment exposure machine for semiconductor lithography process.


Function: 1:1 copy the pattern of the mask to the photoresist film on the wafer surface
with the UV parallel light source.

■ Equipment Specifications :

  • Exposure light source, mask line width replication capability, I-line positive
    photoresist 1um thickness, hard contact, 1um~2um, proximity 3um~5um.

     

■ Align the imaging system:

  • Automatic alignment ability, the align key with clear geometric
    shape can be identified within 5um.

 

■ Productivity :

  • In the alignment process, the output depends on the alignment accuracy and exposure time.
    The fastest approach exposure model can reach 5 pieces per minute.
  • The pattern resolution of vacuum contact exposure is the best, within 1um, and the proximity
    exposure is set at about 5~10um according to the distance between the wafer and the mask.

 

■ External Dimensions Weight:

  • W: 1900 x D1600 x H2400mm

 

■ Weight :

  • Weight about 1700kg