Exposure machines 3", 4", 5", 6" 8'' 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.
Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.
Exposure time 3 seconds, mechanical capacity of 250~300 pieces per hour (regardless of material variation
Auto Exposurer TT07
■ Equipment Specifications:
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Exposure light source , mask line width reproduction capability , I-line positive photoresist 1um thickness, hard contact, 1um~2um,
proximity 3um~5um.
■ Align the imaging system:
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Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.
■ production process:
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For the alignment process , the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour (without considering the material variability).
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No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour (without considering material variability and unloading).
■ External Dimensions :
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W: 1900 x D1600 x H2400mm
■ Weight :
